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Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010
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Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021
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Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021
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Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520
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Low viscosity, RT cure. Impact resistant. Excellent thermal cycle. An exceptionally tough epoxy casting system with excellent low temperature thermal and mechanical shock resistance. CLR 1190 / CLH 6560
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Room Temperature Cure, filled epoxy system suitable for machine dispense. Developed for potting and casting of electrical and electronic components. The cured material exhibits excellent thermal cycling endurance. CLR 1556 / CLH 6640
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Product is recommended for potting and encapsulating applications. A two component, room temperature cure semi-flexible epoxy system. The system was developed for potting / casting of electrical and electronic components. Its use of non abrasive fillers and convenient 1:1 ratio by volume, makes it ideal for use in machine dispensing equipment. CLR 1946 / CLH 6500
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A semi-flexible, 100% solid, epoxy system. This product was specifically developed for potting / casting of electrical and electronic components. The long pot life of the material makes it suitable for large mass castings or heat induced curing with minimal stress. Product passes UL94-HB in-house flammability testing. For a more rigid system, CLR 3517 / CLH 6230 is recommended. CLR 3507 / CLH 6230
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A low viscosity, single component, epoxy potting and encapsulating compound. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL 94-HB flammability requirements. Heat Cure Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. CLS 9611
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Heat Cure. Single Component semi-flexible epoxy potting and encapsulating system. Product is suitable for potting ferrites and pressure sensitive components in electrical and electronic applications. Low viscosity. The product has excellent stability and good adhesion to a wide range of substrates. This product meets UL94-HB flammability requirements. CLS 9616
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A two component polyurethane casting system. Product has long pot-life and cures to a hardness of 65 Shore D. XID 1681 / XHD 1652
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Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182
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1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019
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The product cures to a shore hardness of 50 A, low viscosity, soft system. A two component, very flexible epoxy system. XRD 1347 / XHD 1348
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4:1 Ratio, soft system. A two component unfilled, flexible epoxy system. Product features low viscosity, long pot life and cures to a shore hardness of 70A. XRD 1501 / CLH 6090